General Co-Chairs
Hong YeoGeorgia Tech, USA
Wei GaoCALTECH, USA
Meet the organizers of IEEE FLEPS 2026, dedicated professionals coordinating an impactful event on flexible and printable electronics research and innovation.

Georgia Tech, USA

CALTECH, USA

Georgia Tech, USA

Cambridge University, UK

Baylor University, USA

Northeastern University, Boston, USA

Cambridge University, UK

University of Sydney, Australia

University of Illinois Urbana-Champaign

University of Groningen, The Netherlands

University of Cambridge, UK

University of Southern California, USA

Electrical and Computer Engineering, University of California San Diego

School of Electronics and Computer Science, University of Southampton, UK

Ahmedabad University, India

Department of Chemical & Biomolecular Engineering, Department of Biomedical Engineering (joint), College of Design and Engineering, National University of Singapore

Department of Biomedical Engineering, University of Texas at Austin

Georgia Tech, USA

Politechnico Di Milano, Italy

Rice University, USA

Department of Mechanical Engineering and Materials Science and Department of Biostatistics and Bioinformatics, Duke University

York University, Canada

NCSU, USA

Rice Univ, USA

Georgia Tech, USA

Korea Univ, Korea

VTT, Finland

Northeastern University, Boston, USA

BITS Pilani Hyderabad, India

Delft University of Technology

Electrical and Computer Engineering NC State University, Raleigh, NC, USA

Northeastern University, Boston, USA

University of Wisconsin - Madison, USA

TU Wien and Danube University Krems, Austria

Tampere University, Finland

University of Genova, Italy

Indian Institute of Science Education and Research, Bhopal, India

University of Rome, Italy