IEEE FLEPS 2026 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.
Call for Papers
Submit your research to IEEE FLEPS 2026. Explore the Call for Papers for topics, submission guidelines, and key dates in flexible and printable electronics.
Topics of Interest
- Organic/Inorganic Electronics and Sensors
- Materials and Design for Flexible, Stretchable, and Printed Systems
- Advanced Manufacturing Techniques
- High-throughput Printable Electronics
- Hybrid Systems and Heterogeneous Integration
- Stretchable/Shrinkable Sensors and Electronics
- Wearable and Implantable Systems
- Degradable/Reusable Sensors and Systems
- Printed Large-Area Sensors and Systems
- Active and Passive Components (e.g. actuators, printed energy devices, smart labels, RFID etc.)
- Emerging applications of Flexible Electronics in AI, Robotics, Cognitive Systems, IoT, smart cities etc.
- Reliability, Simulation and Modelling
- Electronics for Sustainability
- Standards for Flexible and Stretchable Electronics
Important Dates
- March 1, 2026Option B: Submit to IEEE Sensors Letters
- March 23, 2026Option A: Submit to IEEE FLEPS 2026 Proceedings
- April 20, 2026Notification of Acceptance
- May 11, 2026Final Manuscript Submission Deadline